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grinding machines disco

Grinding Solutions DISCO Corporation

DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions. The TAIKO process is the name of a wafer back grinding process. This method is different to conventional back grinding. When grinding the wafer, the TAIKO process leaves an edge ...

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DISCO dicing saws and quality equipment - dicing

2021-9-30  DISCO HI-TEC EUROPE GmbH. Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany. Phone +49 89 909 03-0 Fax +49 89 909 03-199. [email protected]

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Ultra-Thin Grinding Grinding Solutions DISCO

DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions. Application Examples. Photo 1 shows a Φ300 mm silicon wafer reduced to 5 µm thickness by grinding only.

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Disco Back Grinding Machines Products Suppliers ...

Products/Services for Disco Back Grinding Machines. Grinders and Grinding Machines - (984 companies) Grinders and grinding machines use an abrasive that is bonded to a wheel, belt or disc to remove material and improve surface finish. Devices can be pneumatically driven or powered by a combustion engine or electric motor.

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Thinning by Grinding Wheel (Grinding) DISCO Technology ...

Fully-Automatic Grinder (Fully-automatic Equipment for Grinding Wheels) The grinders currently available have various automatic functions. In particular, the machines are equipped with wafer handling, thickness measurement, and cleaning functions so that the machine can process the workpieces as a cassette.

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DFG8540 Grinders Product Information DISCO

Grinding Method-Anomalous In-feed grinding with wafer rotation Grinding Wheels-Φ200 mm Diamond Wheel Spindle Output kW 4.2 Revolution speed range min ‐1 1,000 ~ 7,000 Machine dimensions (W × D × H) mm Machine weight kg Approx.3,100

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Disc grinding machines Aceti

The belt grinding machine and disc grinding machines are machines that work by abrasive belts or abrasive discs and are designed to perform operations of grinding, deburring, linishing and finishing of any metal material.This machine are also called belt grinder, belt sander, disc sanders and linishing machines.

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Belt grinding machines - Disc grinding machines Aceti

The belt grinding machine and disc grinding machines are machines that work by abrasive belts or abrasive discs and are designed to perform operations of grinding, deburring, linishing and finishing of any metal material.This machine are also called belt grinder, belt sander, disc sanders and linishing machines.

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Solutions Support Dicing and Grinding Service - DISCO ...

This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai) and DISCO HI-TEC AMERICA(San Jose). It is also possible to provide these services with machines

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UltraPoligrind Grinding Wheels - DISCO

UltraPoligrind employs an ultra-fine diamond abrasive to create higher die strength and enable grinding with even less damage than Poligrind. This new finish grinding wheel is also able to maintain a gettering effect, which is often removed when a stress relief process is used. It is a chemical-free normal grinding process resulting in a low ...

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Grinders: Disco-DFG8540 - Aurotech

2021-9-30  The DFG8540 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8140) for in-line processing solutions. Inherited grinding specifications with an established reputation. DFG8540 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide.

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High quality sapphire processing Grinding - DISCO

With dry polishing (DP), it is possible to obtain a high quality result with surface roughness under 10 nm. An example is shown below. DISCO will help select the optimal processing parameters for your desired applications. Typical grinding process. With DP. Surface roughness. Mid-section. Ra 17 nm. Ra 6 nm.

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GRINDING PROCESS

Grinding machine is a power operated machine tool where, the work piece is fed against constantly rotating abrasive wheel to remove thin layer of material from work. V.Gunasegaran, Assistant Professor, Department of Mechanical Engineering, BSACIST, Chennai -48. Grinding Machine

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Disc grinding machines Aceti

The belt grinding machine and disc grinding machines are machines that work by abrasive belts or abrasive discs and are designed to perform operations of grinding, deburring, linishing and finishing of any metal material.This machine are also called belt grinder, belt sander, disc sanders and linishing machines.

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Grinders: Disco-DFG8540 - Aurotech

2021-9-30  The DFG8540 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8140) for in-line processing solutions. Inherited grinding specifications with an established reputation. DFG8540 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide.

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Disco DAG810 Disco DAG810 Disco DAG810 - AxusTech

2021-8-4  Disco DAG810 is a single axis automatic wafer grinder that can grind wafers up to 300mm diameter. With one air bearing grind spindle and one vacuum chuck mounted on a high precision mechanical lower spindle this grinder has a relatively small footprint of only 11 square feet. This grinder can perform either standard in-feed (plunge) grinding or ...

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Belt grinding machines - Disc grinding machines Aceti

The belt grinding machine and disc grinding machines are machines that work by abrasive belts or abrasive discs and are designed to perform operations of grinding, deburring, linishing and finishing of any metal material.This machine are also called belt grinder, belt sander, disc sanders and linishing machines.

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Grinder/Polisher: Disco-DFM2800 - Aurotech

2021-9-20  Disco-DFM2800 Grinder/Polisher Realizes faster processing of ultrathin wafers Φ300 mm DBG SDBG Wafer Thinning Realizes high yield thin wafer processing The DFM2800 is a specialized wafer mounter for inclusion in an inline system with a backgrinder to process Φ300 mm ultra-thin wafers. It mounts wafers that have been thinned with the DGP8761 system onto dicing tape or tape frames

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Thickness control by using NCG Grinding - DISCO

DISCO's Fully Automatic Grinder and Grinder/Polisher usually measure wafer thickness in grinding process and control wafer thickness by contact gauge. NCG measure wafer thickness without contact, and has advantage below. NCG avoid the risk of breaking wafer which is weak in load, for example the cavity configuration or a wafer ultrathinning.

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UltraPoligrind Grinding Wheels - DISCO

UltraPoligrind employs an ultra-fine diamond abrasive to create higher die strength and enable grinding with even less damage than Poligrind. This new finish grinding wheel is also able to maintain a gettering effect, which is often removed when a stress relief process is used. It is a chemical-free normal grinding process resulting in a low ...

More

High quality sapphire processing Grinding - DISCO

With dry polishing (DP), it is possible to obtain a high quality result with surface roughness under 10 nm. An example is shown below. DISCO will help select the optimal processing parameters for your desired applications. Typical grinding process. With DP. Surface roughness. Mid-section. Ra 17 nm. Ra 6 nm.

More

Hard Disk Grinding Machine : 5 Steps (with Pictures ...

Step 3: Preparar El Disco. 2 More Images. Tiene que quedar asi! (solo el disco y el motorcito brushless) Ahora con cuidado hay que sacar el disco quitando los tornillos (solo el disco, el motor brushless no hay que quitarlo) y recortamos una lija del mismo tamaño, la pegamos al disco

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GRINDING MACHINES - Carnegie Mellon University

2018-7-11  grinding machines, bufting machines. and reciprocating surface grinding machines. UTILITY GRINDING MACHINES The utility grinding machine is intended for offhand grinding where the workpiece is supported in the hand and brought to bear against the rotating grinding abrasive wheel.

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Grinding System Discus - NETZSCH Grinding Dispersing

The NETZSCH Discus system is the quantum leap in disk grinding technology. The further optimized Discus disk agitator combined with the NETZSCH DCC ® separation system guarantees you extremely high throughput rates with significantly narrowerd well time distributions and therefore more intensive grinding with uniform impact intensity.. The power input of the mill increases considerably, with ...

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High Quality Processing of InP (Indium Phosphide ... - DISCO

Dicing and Grinding Service It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at

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Polishing Grinding Manufacturers - Wafer Production ...

Polishing Grinding Manufacturers - Wafer Production Equipment. Companies involved in Polishing Grinding machine production, a key piece of equipment for the production of solar wafers. 24 Polishing Grinding equipment manufacturers are listed below.

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Grinders: Disco-DFG8540 - Aurotech

2021-9-30  The DFG8540 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8140) for in-line processing solutions. Inherited grinding specifications with an established reputation. DFG8540 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide.

More

Grinders: Disco-DGP8761 - Aurotech

2021-10-1  Disco-DGP8761 Grinders High-efficiency grinder/polisher for Φ300 mm wafers Φ300 mm 3 axes, 4 chuck tables DBG SDBG Wafer Thinning Stress Releaf Realizes improvements in process stability and higher throughput The DGP8761 is the successor to the DGP8760, which is used by premier manufacturers worldwide. It integrates backside grinding and stress relief processing and performs

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Belt grinding machines - Disc grinding machines Aceti

The belt grinding machine and disc grinding machines are machines that work by abrasive belts or abrasive discs and are designed to perform operations of grinding, deburring, linishing and finishing of any metal material.This machine are also called belt grinder, belt sander, disc sanders and linishing machines.

More

Grinding System Discus - NETZSCH Grinding Dispersing

The NETZSCH Discus system is the quantum leap in disk grinding technology. The further optimized Discus disk agitator combined with the NETZSCH DCC ® separation system guarantees you extremely high throughput rates with significantly narrowerd well time distributions and therefore more intensive grinding with uniform impact intensity.. The power input of the mill increases considerably, with ...

More

Grinder/Polisher: Disco-DFM2800 - Aurotech

2021-9-20  Disco-DFM2800 Grinder/Polisher Realizes faster processing of ultrathin wafers Φ300 mm DBG SDBG Wafer Thinning Realizes high yield thin wafer processing The DFM2800 is a specialized wafer mounter for inclusion in an inline system with a backgrinder to process Φ300 mm ultra-thin wafers. It mounts wafers that have been thinned with the DGP8761 system onto dicing tape or tape frames

More

Thickness control by using NCG Grinding - DISCO

DISCO's Fully Automatic Grinder and Grinder/Polisher usually measure wafer thickness in grinding process and control wafer thickness by contact gauge. NCG measure wafer thickness without contact, and has advantage below. NCG avoid the risk of breaking wafer which is weak in load, for example the cavity configuration or a wafer ultrathinning.

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Grinding - Di-Coat Corporation

The DCC-Z500 Masonry Block Grinder is a heavy- duty machine designed for high production face grinding of CMU’s using “Di-Coated” Diamond Drums and / or vertical spindle wheels. The modular grinding station setup offers the rapid stock removal of diamond drums and the excellent finish of a vertical spindle diamond disc.

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High Quality Processing of InP (Indium Phosphide ... - DISCO

Dicing and Grinding Service It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at

More

Hard Disk Grinding Machine : 5 Steps (with Pictures ...

Step 3: Preparar El Disco. 2 More Images. Tiene que quedar asi! (solo el disco y el motorcito brushless) Ahora con cuidado hay que sacar el disco quitando los tornillos (solo el disco, el motor brushless no hay que quitarlo) y recortamos una lija del mismo tamaño, la pegamos al disco

More

GRINDING MACHINES - Carnegie Mellon University

2018-7-11  grinding machines, bufting machines. and reciprocating surface grinding machines. UTILITY GRINDING MACHINES The utility grinding machine is intended for offhand grinding where the workpiece is supported in the hand and brought to bear against the rotating grinding abrasive wheel.

More

Grinders: Disco-DAG810 - Aurotech

2021-9-28  Disco-DAG810 Grinders Automatic grinder to respond to new processing needs Φ200 mm 1 axis, 1 chuck table Simple and compact single-axis grinder The DAG810 is a compact, automatic grinder for workpieces up to 8" in diameter. It has one spindle and one chuck table and is designed to process a variety of materials.

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Wafer Grindier As Disco Dfg8560 - Buy Grinder,Disco ...

Wafer Grindier As Disco Dfg8560 , Find Complete Details about Wafer Grindier As Disco Dfg8560,Grinder,Disco from Other Grinding Machines Supplier or Manufacturer-Guangzhou Minder-Hightech Co., Ltd.

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The Center Offset Grinding of TAIKO Wafer - DISCO

The Center Offset Grinding of TAIKO Wafer. The TAIKO process is a wafer backgrinding method developed by DISCO. This process method leaves a ring (approximately 3 mm) on the wafer outer edge and thin grinds only the inner area of the backside wafer. By leaving this edge ring, it is possible to reduce the risks of wafer breakage or edge chipping.

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